H10W 44/219
Characterised by transitions between different types of waveguides
Official title: {characterised by transitions between different types of waveguides}
H10W44/219 (Characterised by transitions between different types of waveguides) appears on 99 US grants and 106 published applications in this corpus.
Search patents in H10W- Granted patents
- 99
- Published applications
- 106
- Assignees
- 60
- Inventors
- 224
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 3 |
| 2004 | 2 | 2 |
| 2005 | 2 | 4 |
| 2006 | 1 | 1 |
| 2007 | 1 | 2 |
| 2008 | 4 | 3 |
| 2009 | 2 | 8 |
| 2010 | 5 | 3 |
| 2011 | 4 | 5 |
| 2012 | 6 | 8 |
| 2013 | 3 | 4 |
| 2014 | 6 | 4 |
| 2015 | 3 | 6 |
| 2016 | 10 | 9 |
| 2017 | 3 | 1 |
| 2018 | 7 | 2 |
| 2019 | 2 | 8 |
| 2020 | 5 | 11 |
| 2021 | 6 | 2 |
| 2022 | 4 | 3 |
| 2023 | 3 | 6 |
| 2024 | 2 | 5 |
| 2025 | 5 | 3 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Microelectronic device package with integral waveguide transition4 Aug 2026US 12,700,655 B2Texas Instruments Incorporated
- Balun phase and amplitude imbalance correction4 Aug 2026US 12,700,843 B2Texas Instruments Incorporated
- System, electronic device and package with vertical to horizontal substrate integrated waveguide transition and horizontal grounded coplanar waveguide transition6 Jan 2026US 12,519,070 B2Texas Instruments Incorporated
- Radio frequency chip, signal transceiver, and communication device9 Dec 2025US 12,494,564 B2Huawei Technologies Co., Ltd.
- Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure11 Nov 2025US 12,469,805 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Additively manufactured coaxial interconnects14 May 2026US 2026/0136942 A1BAE Systems Information and Electronic Systems Integration Inc.
- Method of fabricating a flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate15 Jan 2026US 2026/0018542 A1Texas Instruments Incorporated
- Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure20 Nov 2025US 2025/0357391 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Stripline monolithic microwave integrated circuit (mmic) interconnect on recessed low temperature co-fired ceramic (ltcc)1 May 2025US 2025/0140717 A1Board of Trustees of the University of Arkansas
- Integrated Waveguides for Semiconductor Technology2 Jan 2025US 2025/0006668 A1Intel Corporation
Most cited
By later US patents
- Three-dimensional microwave circuit carrier and integral waveguide coupler226US 5,045,820 AMotorola, Inc. · 1991
- Low-loss interface222US 7,782,156 B2ViaSat, Inc. · 2010
- Radio communication device with integrated antenna, transmitter, and receiver158US 6,809,688 B2Sharp Kabushiki Kaisha · 2004
- Integrated antenna and chip package and method of manufacturing thereof97US 7,768,457 B2Vubiq Incorporated · 2010
- Millimeter-wave LTCC package88US 5,982,250 ATWR Inc. · 1999