Radio frequency chip, signal transceiver, and communication device
AssigneeHuawei Technologies Co., Ltd.
InventorsLuqi Zhang, Kun Li, Xianfeng Tang, Yanxing Luo
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AssigneeHuawei Technologies Co., Ltd.
InventorsLuqi Zhang, Kun Li, Xianfeng Tang, Yanxing Luo
Estimating the term…
This disclosure provides a radio frequency chip, a signal transceiver, and a communication device. The radio frequency chip includes: a chip; a coupling structure, including: a resonator, where a resonant cavity is formed, and an inner wall of the resonant cavity is made of metal; a redistribution layer, arranged above the resonant cavity and including an redistribution layer (RDL) dielectric layer; a radiator, made of metal, formed into a centro-symmetric shape, arranged on a surface that is of the dielectric layer and that faces the resonator, and accommodated in the resonant cavity; a feeder, where one end of the feeder is connected to the chip, and the other end is inserted into the resonant cavity; a packaging structure, configured to package the chip and cover the redistribution layer, so that a signal generated by the chip can be efficiently coupled to a polymer transmission line.
A radio frequency chip, comprising:
A signal transceiver, comprising:
A communication device, comprising:
Dependencies are inferred from the claim text.