Millimeter-wave LTCC package

A circuit module comprising:

• a multi-layer substrate comprising:
• a first dielectric layer having a top side and a bottom side;
• a second dielectric layer having a top side and a bottom side;
• and
• a first conductive layer disposed between said bottom side of said first dielectric layer and said top side of said second dielectric layer,
• said second dielectric layer having an aperture forming a waveguide;
• said first conductive layer having an aperture forming a waveguide and aligned with the aperture in said second dielectric layer;
• a conductive coating on said top side of said first dielectric layer, said conductive coating having an aperture aligned with the aperture in said second dielectric layer;
• a waveguide extension located in at least said first dielectric layer;
• and
• a microstrip located on said top side of said first dielectric layer inside the aperture described by said conductive coating;
• and
• a metal base supporting said multi-layer substrate, said metal base having an aperture aligned with the aperture in said second dielectric layer;
• a metal ring supported by said multi-layer substrate, said metal ring aligned with the aperture in said second dielectric;
• and
• a metal cover on top of said metal ring.

A waveguide to microstrip transition comprising:

• a base of conducting material having an aperture forming a waveguide;
• alternating layers of dielectric and conductor positioned on top of said base, each layer of dielectric and conductor having an aperture aligned with the aperture in said base forming a waveguide;
• at least one sealing layer of dielectric positioned on top of said alternating layers of dielectric and conductor, said sealing layer extending across the entire aperture of said alternating layers of dielectric and conductor, said sealing layer having a plurality of metallized vias forming a waveguide extension surrounding the aperture of said alternating layers of dielectric and conductor;
• a microstrip positioned on top of said sealing layer, said microstrip aligned with the aperture of said alternating layers of dielectric and conductor;
• a ring frame of conducting material positioned on top of said sealing layer aligned with the aperture in said base forming a waveguide surrounding said microstrip;
• and
• a lid of conducting material positioned on top of said metallic ring frame.