US 12,700,655 B2 · Microelectronic device package with integral waveguide transition

Abstract

An example device includes: a multilayer build-up package substrate including trace conductor layers spaced from one another by dielectric material, and further including connection conductor layers coupling portions of the trace conductor layers through dielectric material, the multilayer build-up package substrate having a device side surface with one of the trace conductor layers and an opposing board side surface with one of the connection conductor layers; and a waveguide transition formed from the multilayer build-up package substrate, the waveguide transition having an input port formed from the connection conductor layer on the board side surface, and having at least two sub-transitions spaced laterally from one another, the at least two sub-transitions to couple a signal from the input port through the trace conductor layers and the connection conductor layers to a coplanar waveguide formed from the trace conductor layer on the device side surface.

Claims32

Dependent claims

A method, comprising:

forming a multilayer build-up package substrate comprising conductors arranged as trace conductor layers spaced from one another by dielectric material and arranged as connection conductor layers coupling portions of the trace conductor layers through the dielectric material, the multilayer build-up package substrate having a trace conductor layer on a device side surface and having an opposing board side surface with a connection conductor layer on the board side surface;
forming a waveguide transition from the multilayer build-up package substrate, the waveguide transition having an input port formed from the connection conductor layer on the board side surface, and having at least two sub-transitions spaced laterally from one another and configured to couple a signal from the input port through the trace conductor layers and the connection conductor layers to a coplanar waveguide formed from the trace conductor layer on the device side surface;
and
forming an antenna from the trace conductor layer on the device side surface, wherein the antenna is coupled to the coplanar waveguide.

1 more element

A microelectronic device package, comprising:

a multilayer build-up package substrate comprising conductors arranged as trace conductor layers spaced from one another by dielectric material and arranged as connection conductor layers configured to couple portions of the trace conductor layers through the dielectric material, the multilayer build-up package substrate having a device side surface with a trace conductor layer on the device side surface and an opposing board side surface with a connection conductor layer on the board side surface;
a waveguide transition formed from the multilayer build-up package substrate, the waveguide transition having an input port formed from the connection conductor layer on the board side surface, and having at least two sub-transitions spaced laterally from one another and coupling a signal from the input port through the trace conductor layers to a coplanar waveguide formed from the trace conductor layer on the device side surface;
and
mold compound covering the device side surface of the multilayer build-up package substrate, wherein the coplanar waveguide on the device side surface comprises a grounded coplanar waveguide.

1 more element

A device, comprising:

a multilayer build-up package substrate comprising trace conductor layers spaced from one another by dielectric material, and further comprising connection conductor layers coupling portions of the trace conductor layers through the dielectric material, the multilayer build-up package substrate having a device side surface with one of the trace conductor layers on the device side surface and an opposing board side surface with one of the connection conductor layers on the board side surface;
and
a waveguide transition formed from the multilayer build-up package substrate, the waveguide transition having an input port formed from the one of the connection conductor layers on the board side surface, and having at least two sub-transitions spaced laterally from one another, the at least two sub-transitions configured to couple a signal from the input port through the trace conductor layers and the connection conductor layers to a coplanar waveguide formed from the one of the trace conductor layers on the device side surface, wherein the coplanar waveguide is a grounded coplanar waveguide.

Dependencies are inferred from the claim text.

Microelectronic device package with integral waveguide transition

Life of this patent

Microelectronic device package with integral waveguide transition

Life of this patent

Abstract

Claims32