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US 6,809,688 B2Granted
Radio communication device with integrated antenna, transmitter, and receiver
AssigneeSharp Kabushiki Kaisha
InventorAtsushi Yamada
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AssigneeSharp Kabushiki Kaisha
InventorAtsushi Yamada
Estimating the term…
A dielectric multilayer substrate 220 is formed by laminating first through third dielectric layers 201 through 203. A plurality of conductor patches 204a through 204d are arranged on the upper surface of the first dielectric layer 201, and a microstrip line 205 for antenna feeding is arranged between the first and second dielectric layers. A ground layer 206 is arranged between the second and third dielectric layers 202 and 203, and microstrip lines 208a and 208b for a high-frequency circuit are arranged on the lower surface of the third dielectric layer 203. The microstrip line 205 for antenna feeding and the microstrip line 208a for the high-frequency circuit are electromagnetically coupled with each other via a slot hole 207 provided for the ground layer 206. With this arrangement, the efficiency and directivity of the antenna are improved.
An antenna-integrated radio communication device having a dielectric multilayer substrate in which a plurality of dielectric layers are laminated and a high-frequency circuit on which semiconductor chips are mounted, wherein
An antenna-integrated radio communication device, wherein a plurality of conductor patches, an antenna feeder line, a ground layer and a high-frequency circuit are provided in order from an upper surface to a lower surface of a dielectric multilayer substrate on the upper surface, between layers and on the lower surface, respectively, of the dielectric multilayer substrate in which three dielectric layers are laminated.
Dependencies are inferred from the claim text.