Micro-patch antenna connected to circuits chips
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKazuaki Takahashi, Suguru Fujita, Morikazu Sagawa
Life of this patent
Estimating the term…
Loading patent…
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKazuaki Takahashi, Suguru Fujita, Morikazu Sagawa
Estimating the term…
An antenna apparatus comprises: a first chip having: a substrate; a ground film on the substrate; a dielectric film on the ground film; a micro-patch antenna on the dielectric film; a microstrip line extending from the micro-patch antenna; and an in/output microstrip line on the dielectric film; a second chip having a circuit for effecting an operation with the antenna; and a connecting portion for fixing the second chip to the first chip by providing mechanical and electrical connection (flip-chip bonding) between the circuit and the microstrip line and between the circuit and the in/output microstrip line. The substrate comprises a silicon, a GaAs substrate, or a dielectric substrate. The antenna may be provided on the bottom surface of the substrate and be provided on a third substrate also connected by the flip-chip bonding wherein the second chip and the antenna is connected using a through hole. Instead of the through hole, the antenna is coupled to the circuit portion electromagnetically. The substrate may have a hollow portion and the second chip may be accommodated in the hollow portion and the antenna may be provided on a third chip covering the second chip.
An antenna apparatus comprising:
An antenna apparatus comprising:
An antenna apparatus comprising:
An antenna apparatus comprising:
An antenna apparatus comprising:
An antenna apparatus comprising:
Dependencies are inferred from the claim text.