Waveguide structures semiconductor package including the same

A waveguide structure comprising:

• a first substrate;
• a first wiring on the first substrate, the first wiring extending in a first direction;
• a second wiring spaced apart from the first substrate and the first wiring, the second wiring extending in the first direction and opposing the first wiring;
• and
• a plurality of solder patterns electrically connected to the first wiring and the second wiring and spaced apart from each other in the first direction and in a second direction intersecting the first direction such that the plurality of solder patterns define a waveguide region extending along the first direction between the first wiring and the second wiring.

A semiconductor package comprising:

• a first substrate;
• an interconnector on the first substrate and configured to receive an RF signal;
• an integrated circuit mounted on the first substrate and spaced apart from the interconnector in a first direction;
• a waveguide structure configured to transmit the RF signal from the interconnector and to the integrated circuit;
• a semiconductor chip mounted on the first substrate and spaced apart from the waveguide structure,
• wherein the waveguide structure includes
• a first wiring on the first substrate,
• a second wiring spaced apart from the first wiring and the first substrate, and
• a plurality of solder patterns between the first wiring and the second wiring, the plurality of solder patterns spaced apart from each other in the first direction, and defining a waveguide region between the first wiring and the second wiring such that the waveguide region extends along the first direction.