H10W 44/206
Wires
Official title: {Wires}
H10W44/206 (Wires) appears on 964 US grants and 1,023 published applications in this corpus.
Search patents in H10W- Granted patents
- 964
- Published applications
- 1,023
- Assignees
- 293
- Inventors
- 1,670
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 8 | 0 |
| 1999 | 8 | 0 |
| 2000 | 7 | 0 |
| 2001 | 12 | 7 |
| 2002 | 18 | 26 |
| 2003 | 26 | 18 |
| 2004 | 14 | 21 |
| 2005 | 16 | 30 |
| 2006 | 24 | 27 |
| 2007 | 17 | 33 |
| 2008 | 23 | 18 |
| 2009 | 18 | 33 |
| 2010 | 22 | 25 |
| 2011 | 16 | 16 |
| 2012 | 22 | 30 |
| 2013 | 28 | 20 |
| 2014 | 25 | 44 |
| 2015 | 35 | 44 |
| 2016 | 52 | 60 |
| 2017 | 67 | 65 |
| 2018 | 70 | 56 |
| 2019 | 65 | 60 |
| 2020 | 64 | 66 |
| 2021 | 44 | 68 |
| 2022 | 64 | 69 |
| 2023 | 36 | 63 |
| 2024 | 51 | 57 |
| 2025 | 46 | 33 |
| 2026 | 32 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power amplifier and radio frequency module6 Oct 2026US 12,756,368 B2Mitsubishi Electric Corporation
- Package structure with transmission line and method for manufacturing the same29 Sep 2026US 12,751,293 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Power amplifier device having dies with elongated bondpads connected through a device substrate15 Sep 2026US 12,738,906 B2NXP USA, Inc.
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Methods related to dual-sided radio-frequency package with overmold structure25 Aug 2026US 12,721,179 B2Skyworks Solutions, Inc.
- Custom rf inductors for rf modules24 Sep 2026US 2026/0293692 A1Qorvo US, Inc.
- High-speed signal stabilization in a common substrate24 Sep 2026US 2026/0293693 A1Micron Technology, Inc.
- Amplifier circuit10 Sep 2026US 2026/0269792 A1Sumitomo Electric Device Innovations, Inc.
- Rf amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging6 Aug 2026US 2026/0230051 A1Wolfspeed, Inc.
- Package-integrated lead frame antennas6 Aug 2026US 2026/0231783 A1
Most cited
By later US patents
- High frequency chip packages with connecting elements238US 7,176,506 B2Tessera, Inc. · 2007
- Packaged semiconductor with multiple rows of bond pads and method therefor131US 6,476,506 B1Motorola, Inc. · 2002
- Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes130US 6,539,531 B2FormFactor, Inc. · 2003
- Integrated circuit chip using top post-passivation technology and bottom structure technology110US 8,456,856 B2Megica Corporation · 2013
- Wirebond assembly for high-speed integrated circuits90US 6,538,336 B1Rambus Inc. · 2003