Package-integrated lead frame antennas

A semiconductor package, comprising:

• a portion of a lead frame including a die pad, a package pin, and an antenna having a meandering portion that includes multiple linear segments linked in series at approximately right angles, each of the multiple linear segments at least partially separated from another one of the multiple linear segments by a non-metallic region;
• a semiconductor die coupled to the die pad, the package pin, and the antenna;
• and
• a mold compound covering the portion of the lead frame and the semiconductor die.

A method for manufacturing a semiconductor package, comprising:

• coupling a first semiconductor die to a first die pad of a lead frame, the lead frame further comprising a second die pad, first and second package pins, and first and second antennas, the first and second antennas coupled directly to each other without a tie bar in between the first and second antennas, each of the first and second antennas including multiple linear segments coupled in series at approximately right angles;
• coupling a second semiconductor die to the second die pad;
• wirebonding the first semiconductor die to the first package pin and the first antenna;
• wirebonding the second semiconductor die to the second package pin and the second antenna;
• covering the first and second semiconductor dies, the first and second die pads, and the first and second antennas with a mold compound;
• and
• cutting the mold compound and the lead frame in between the first and second antennas to produce the semiconductor package.