US 7,176,506 B2 · High frequency chip packages with connecting elements

Abstract

A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.

Claims18

Dependent claims

A microelectronic package comprising:

(a) at least one lower chip;
(b) a connecting element extending above said at least one lower chip and extending in at least one horizontal direction beyond said at least one lower chip;
(c) a bottom plane element defining at least a portion of a bottom surface of the package below said at least one lower chip and including a plurality of terminals exposed at said bottom surface and a thermal conductor exposed at said bottom surface, said thermal conductor having area larger than the area of each of said terminals, said thermal conductor being at least partially aligned with said at least one lower chip, at least some of said terminals being electrically connected to at least some of said contacts of said at least one lower chip by said connecting element, said terminals including a plurality of active terminals, and a plurality of active leads projecting upwardly from said active terminals to said connecting element.

Dependencies are inferred from the claim text.

Facts

Application

10/746,810Filed 24 Dec 2003 · continuation in part

Priority

28 Aug 2001

Published

US 2004/0238857 A12 Dec 2004

Granted

13 Feb 2007

Term ends

Not estimatedThe source records don’t support an estimate.

Classification61 codes

G06F 21/10
Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity: protecting distributed…
H01F 17/0033
Printed inductances: with the coil helically wound around a magnetic core
H03H 9/0542
Constructional combinations of supports or holders with electromechanical or other electronic elements: consisting of a lateral arrangement
H03H 9/0547
Constructional combinations of supports or holders with electromechanical or other electronic elements: consisting of a vertical arrangement

Family

Application60/315,408Us provisional application · filed 28 Aug 2001

Application10/210,160Parent of this continuation-in-part · filed 1 Aug 2002

PCT/US02/27509Parent of this continuation-in-part · filed 28 Aug 2002

Application60/449,673Us provisional application · filed 25 Feb 2003

Application60/462,170Us provisional application · filed 11 Apr 2003

US 2004/0238857 A1Pre-grant publication · published 2 Dec 2004

US 6,856,007 B2Parent of this continuation-in-part

US 2003/0062541 A1Published application

US 7,176,506 B2This patent

From the US filing history. Foreign family members aren’t listed.

High frequency chip packages with connecting elements

Life of this patent

High frequency chip packages with connecting elements

Life of this patent

Abstract

Claims18