Integrated circuit chip using top post-passivation technology and bottom structure technology
AssigneeMegica Corporation
InventorsMou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Ping-Jung Yang, Te-Sheng Liu
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Abstract
Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.
Claims20
A module comprising:
- a substrate;
- a processor unit on said substrate, wherein said processor unit comprises a first cache memory chip over said substrate and a processor chip over said first cache memory chip, wherein said first cache memory chip is connected to said processor chip through a plurality of microbumps between said first cache memory chip and said processor chip, wherein a pitch between a neighboring two of said plurality of microbumps is smaller than 60 micrometers;
- a mass storage on said substrate, wherein said mass storage comprises a first memory chip over said substrate and a second memory chip over said first memory chip, wherein said first memory chip is connected to said second memory chip through at least one first wirebonded wire;
- a main memory on said substrate, wherein said main memory comprises a first dynamic-random-access-memory chip over said substrate and a second dynamic-random-access-memory chip over said first dynamic-random-access-memory chip;
- and
- a connector connected to said substrate.
Dependencies are inferred from the claim text.