Packaged semiconductor with multiple rows of bond pads and method therefor

A method of electrically connecting a semiconductor die to a die carrier, comprising:

• providing a die having multiple rows of bonding pad that are aligned;
• wire bonding a first wire to an outer row die pad to form a wire bond having a first height;
• attaching a second wire to an inner row die pad to form an electrical connection on the inner row die pad;
• extending the second wire at a second height greater than the first height and overlying the first wire to a second package bonding pad;
• attaching the second wire to the second package bonding pad;
• and
• completing wire bonding of remaining die bonding pads of the semiconductor die;
• wherein the wire bonding of the first wire to the outer row die pad comprises:
• forming a ball;
• shearing off the first wire from the ball;
• wire bonding a remainder portion of the first wire to a first package bonding site;
• and
• attaching the first wire to the ball in the outer row die pad.

A semiconductor package comprising:

• a first die having at least two rows of bond pads that are aligned with respect to a side of the first die;
• a second die overlying the first die, the second die having at least two rows of bond pads that are aligned with respect to a side of the second die;
• a die carrier underlying the first die and the second die for supporting the first die and the second die and providing a plurality of bond fingers;
• a first wire bond connecting a first bond pad contained within a first of the at least two rows of bond pads of the first die to a predetermined bond finger of the plurality of bond fingers;
• and
• a second wire bond connecting a second bond pad contained within a second of the at least two rows of bond pads of the first die to a predetermined bond pad within one of the at least two rows of bond pads of the second die.