H10W 44/255
For operation at multiple different frequencies
Official title: {for operation at multiple different frequencies}
H10W44/255 (For operation at multiple different frequencies) appears on 151 US grants and 178 published applications in this corpus.
Search patents in H10W- Granted patents
- 151
- Published applications
- 178
- Assignees
- 87
- Inventors
- 384
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 5 | 2 |
| 2003 | 0 | 8 |
| 2004 | 5 | 3 |
| 2005 | 3 | 3 |
| 2006 | 4 | 4 |
| 2007 | 4 | 5 |
| 2008 | 5 | 5 |
| 2009 | 3 | 9 |
| 2010 | 2 | 4 |
| 2011 | 6 | 1 |
| 2012 | 8 | 7 |
| 2013 | 3 | 2 |
| 2014 | 5 | 3 |
| 2015 | 3 | 6 |
| 2016 | 4 | 4 |
| 2017 | 6 | 12 |
| 2018 | 11 | 7 |
| 2019 | 9 | 10 |
| 2020 | 9 | 12 |
| 2021 | 10 | 10 |
| 2022 | 10 | 10 |
| 2023 | 6 | 17 |
| 2024 | 3 | 15 |
| 2025 | 16 | 9 |
| 2026 | 8 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package, base station, mobile device and method for forming a semiconductor package26 May 2026US 12,642,103 B2Intel Corporation
- Power amplifier chip and communication device12 May 2026US 12,627,268 B2Huawei Technologies Co., Ltd.
- Package dies including vertical interconnects for signal and power distribution in a three-dimensional (3D) integrated circuit (IC) package12 May 2026US 12,628,354 B2QUALCOMM Incorporated
- Transistor28 Apr 2026US 12,615,833 B2Mitsubishi Electric Corporation
- Electronic device31 Mar 2026US 12,593,725 B2Innolux Corporation
- Semiconductor package including printed circuit board28 May 2026US 2026/0150184 A1Samsung Electronics Co., Ltd.
- Electronic device7 May 2026US 2026/0130211 A1Advanced Semiconductor Engineering, Inc.
- Electronic device and multilevel package substrate with integrated filter19 Mar 2026US 2026/0082931 A1
- Radiofrequency filter12 Mar 2026US 2026/0076211 A1United Microelectronics Corp.
- Radiofrequency filter12 Mar 2026US 2026/0076212 A1United Microelectronics Corp.
Most cited
By later US patents
- Multiple chip module with integrated RF capabilities163US 6,377,464 B1Conexant Systems, Inc. · 2002
- Stacked module package156US 6,734,539 B2Lucent Technologies Inc. · 2004
- Shielded antenna in a semiconductor package148US 6,770,955 B1Skyworks Solutions, Inc. · 2004
- Structures for preventing cross-talk between through-silicon vias and integrated circuits128US 8,227,902 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2012
- RF power amplifier assembly employing multi-layer RF blocking filter54US 6,473,314 B1Powerwave Technologies, Inc. · 2002