Multiple chip module with integrated RF capabilities

A multiple chip module comprising:

• a single interconnect substrate comprising an outer surface having a plurality of wire bond contact points resident thereon;
• an RF/IF active circuit chip configured to perform at least one RF/IF function, said at least one RF/IF active circuit chip being coupled to said plurality of wire bond contact points with a like number of wire bonds;
• and
• a passive component surface-mounted to said single interconnect substrate.

A multiple chip module comprising:

• a single interconnect substrate;
• a first RF/IF active circuit chip coupled to said single interconnect substrate, said first RF/IF active circuit chip being configured to perform a first RF/IF function;
• a second RF/IF active circuit chip coupled to said single interconnect substrate, said second RF/IF active circuit chip being configured to perform a second RF/IF function;
• a first ground plane integral to said single interconnect substrate and operatively associated with said first RF/IF active circuit chip;
• and
• a second ground plane integral to said single interconnect substrate and operatively associated with said second RF/IF active circuit chip.

A multiple chip module comprising:

• a single interconnect substrate;
• an RF/IF active circuit chip coupled to said single interconnect substrate, said first RF/IF active circuit chip having a first portion configured to perform a first RF/IF function and a second portion configured to perform a second RF/IF function;
• wherein
• said single interconnect substrate comprises a first ground plane operatively associated with said first portion of said RF/IF active circuit chip and a second ground plane operatively associated with said second portion of said second RF/IF active circuit chip.

A multiple chip module comprising:

• a single interconnect substrate comprising an upper surface and a lower surface, said upper surface having a die attach pad located thereon and said lower surface having a conductive ground attachment pad located thereon;
• an RF/IF active circuit chip coupled to said die attach pad;
• and
• a via formed within said single interconnect substrate, said via being configured to establish an electrical and thermal connection between said RF/IF active circuit chip and said conductive ground attachment pad.

A multiple chip module comprising:

• a single interconnect substrate comprising an outer surface having a die attach pad resident thereon;
• an RF/IF active circuit chip coupled to said die attach pad, said RF/IF active circuit chip being configured to perform a plurality of RF/IF functions;
• and
• a plurality of plated through vias electrically coupled to said die attach pad, said plurality of plated through vias being positioned, relative to said die attach pad, to enhance isolation between said plurality of RF/IF functions.

A multiple chip module comprising:

• a single interconnect substrate;
• a die attach pad located on an outer surface of said single interconnect substrate;
• and
• at least one RF/IF active circuit chip configured to perform a plurality of RF/IF functions, said at least one RF/IF active circuit chip being coupled to said die attach pad;
• wherein
• said die attach pad is configured to enhance electrical characteristics of said multiple chip module such that said plurality of RF/IF functions are substantially integrated onto said single interconnect substrate.

A multiple chip module comprising:

• a single interconnect substrate comprising an outer surface having a plurality of wire bond contact points resident thereon;
• an active circuit chip downbonded to one of said contact points;
• a first ground plane integral to said interconnect substrate and operatively associated with an RF section;
• a second ground plane integral to said interconnect substrate and operatively associated with an IF section;
• a passive component embedded in said interconnect substrate;
• and
• a passive component surface-mounted to said interconnect substrate.

A multiple chip module comprising:

• a single interconnect substrate;
• at least one active circuit chip coupled to said substrate and configured to perform an RF function and an IF function;
• and
• a plurality of passive components coupled to said substrate, at least one of said passive components comprising a printed passive component.

A multiple chip module comprising:

• a single interconnect substrate;
• at least one active circuit chip downbonded to said substrate and configured to perform an RF function and an IF function;
• and
• a plurality of passive components coupled to said substrate.