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US 12,627,268 B2Granted
Power amplifier chip and communication device
AssigneeHuawei Technologies Co., Ltd.
InventorsWei Xu, Po Shi, Zhengde Yang, Yufeng Wang, Junhao Zou, Qingquan Luo, Shengchang Shangguan
Life of this patent
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Abstract
Example power amplifier chips and communication devices are described. One example power amplifier chip includes a package housing and a plurality of power amplifier dies. The plurality of power amplifier dies are packaged in the package housing, and each of the plurality of power amplifier dies includes at least one stage of power amplifier.
Claims19
A power amplifier chip, comprising:
- a package housing, wherein the package housing comprises a packaging material;
- a plurality of power amplifier dies, wherein:
- the plurality of power amplifier dies respectively support different radio frequency bands;
- the plurality of power amplifier dies are configured for supporting dual-connectivity or multi-connectivity;
- the plurality of power amplifier dies are packaged in the packaging material;
- and
- each of the plurality of power amplifier dies comprises at least one stage of power amplifier;
- and
- a first switch located in the package housing, wherein the first switch is configured to connect or disconnect a first capacitor between a common ground and a power terminal of a first power amplifier die of the plurality of power amplifier dies, wherein the first power amplifier die comprises the power terminal of the first power amplifier die, and a second power amplifier die of the plurality of power amplifier dies comprises a power terminal of the second power amplifier die.
6 more elements
A communication device, wherein the communication device comprises a power supply device and a power amplifier chip, wherein the power amplifier chip comprises:
- a package housing, wherein the package housing comprises a packaging material;
- and
- a plurality of power amplifier dies, wherein:
- the plurality of power amplifier dies are packaged in the packaging material;
- each of the plurality of power amplifier dies comprises at least one stage of power amplifier;
- a first power supply device of the power supply device is configured to supply power to a first power amplifier die in the power amplifier chip;
- and
- a second power supply device of the power supply device is configured to supply power to a remaining power amplifier die in the power amplifier chip.
5 more elements
Dependencies are inferred from the claim text.