Semiconductor package including printed circuit board
AssigneeSamsung Electronics Co., Ltd.
InventorHyeongseok Kang
Life of this patent
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Abstract
A semiconductor package includes a printed circuit board and a semiconductor chip electrically connected to the printed circuit board. The printed circuit board includes a plurality of chip connection pads and a plurality of signal correction patterns spaced apart from the plurality of chip connection pads. The semiconductor chip includes a plurality of chip pads. The printed circuit board further includes thereon a board connection member configured to electrically connect the plurality of chip connection pads to the plurality of signal correction patterns to thereby correct signal characteristics between the plurality of chip pads and the plurality of chip connection pads.
Claims20
A semiconductor package comprising:
- a printed circuit board;
- and
- a semiconductor chip electrically connected to the printed circuit board,
- wherein the printed circuit board comprises:
- a plurality of chip connection pads;
- and
- a plurality of signal correction patterns spaced apart from the plurality of chip connection pads,
- wherein the semiconductor chip comprises a plurality of chip pads, and
- wherein the printed circuit board further comprises thereon a board connection member configured to electrically connect the plurality of chip connection pads to the plurality of signal correction patterns to correct signal characteristics between the plurality of chip pads and the plurality of chip connection pads.
A semiconductor package comprising:
- a printed circuit board comprising signal correction patterns;
- a semiconductor chip mounted on the printed circuit board;
- a first signal line configured to electrically connect a first connection point on the printed circuit board to a second connection point on the semiconductor chip;
- and
- a second signal line configured to electrically connect a third connection point on the signal correction patterns to the first connection point on the printed circuit board, the third connection point being spaced apart from the first and second connection points,
- wherein a second length of the second signal line is greater than a first length of the first signal line to correct signal characteristics of the first signal line.
A semiconductor package comprising:
- a printed circuit board;
- and
- a semiconductor chip mounted on the printed circuit board and electrically connected to the printed circuit board via a connection member,
- wherein the printed circuit board comprises:
- a plurality of chip connection pads arranged on a board base, wherein the plurality of chip connection pads comprise a plurality of low-speed signal chip connection pads and at least one high-speed signal chip connection pad;
- and
- a signal correction unit spaced apart from the plurality of chip connection pads on the board base, wherein the signal correction unit comprises a plurality of signal correction patterns spaced apart from each other, and
- wherein the semiconductor chip comprises a plurality of chip pads, wherein the plurality of chip pads comprise a plurality of low-speed signal chip pads and at least one high-speed signal chip pad, and
- wherein the connection member comprises:
- chip connection members configured to electrically connect the plurality of chip pads to the plurality of chip connection pads, wherein the chip connection members comprise a plurality of low-speed signal chip connection members configured to electrically connect the plurality of low-speed signal chip pads to the plurality of low-speed signal chip connection pads and a high-speed signal chip connection member configured to connect the at least one high-speed signal chip pad to the at least one high-speed signal chip connection pad;
- and
- a board connection member configured to electrically connect the at least one high-speed signal chip connection pad to at least one of the plurality of signal correction patterns.
Dependencies are inferred from the claim text.