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US 8,227,902 B2Granted
Structures for preventing cross-talk between through-silicon vias and integrated circuits
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChen-Cheng Kuo
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Abstract
A semiconductor chip includes a through-silicon via (TSV), a device region, and a cross-talk prevention ring encircling one of the device region and the TSV. The TSV is isolated from substantially all device regions comprising active devices by the cross-talk prevention ring.
Claims19
A semiconductor chip comprising:
- a through-substrate via (TSV) extending through a semiconductor substrate, the TSV being a signal-carrying TSV;
- a device region;
- and
- a cross-talk prevention ring comprising a first portion in a metallization layer over the semiconductor substrate, the first portion encircling the device region, wherein the TSV is isolated from substantially all device regions comprising active devices by the cross-talk prevention ring, the cross-talk prevention ring comprising a conductive material.
1 more element
Dependencies are inferred from the claim text.