Electronic device and multilevel package substrate with integrated filter

A method of fabricating an electronic device, the method comprising:

• forming a multilevel package substrate, including:
• forming a first conductive metal trace that forms a set of contiguous metal structures including a filter input terminal, a first capacitor plate of a first capacitor, a serpentine first inductor winding of a first inductor, and a first capacitor plate of a second capacitor,
• forming a dielectric layer over the first conductive metal trace, and
• forming a second conductive metal trace over the dielectric layer, the second conductive metal trace having a set of contiguous metal structures including a second capacitor plate of the first capacitor, a second capacitor plate of the second capacitor, and a reference terminal;
• attaching a semiconductor die to the multilevel package substrate;
• electrically coupling a conductive structure of the semiconductor die to a filter terminal of the multilevel package substrate;
• and
• forming a package structure that encloses the semiconductor die and a portion of the multilevel package substrate.