RF power amplifier assembly employing multi-layer RF blocking filter

An RF power amplifier assembly, comprising:

• a housing;
• an RF shield partition dividing the housing, at least in part, into a first region and second region;
• an RF electronics module comprising RF amplifier circuitry disposed in the first region of the housing and generating RF signals;
• a control electronics module comprising amplifier control circuitry disposed in the second region of the housing and providing low frequency signals;
• and
• a connector, having a first contact electrically coupled to the control electronics module and a second contact electrically coupled to the RF electronics module, said connector including an electrical path between the contacts electrically coupling the low frequency signals from the control electronics module to the RF electronics module, the connector having a multi-layered structure configured and dimensioned so as to block transmission of the RF signals through the connector structure, the multi-layered connector further comprising an RF blocking filter element electrically coupled to the electrical path to block transmission of the RF signals between the first and second contacts.

A method for assembling an electronics assembly, the method comprising:

• providing a first multi-layered electronics module having a multi-layered filter assembly that includes an input, an RF interference filter element, a ground plane and a trace line;
• disposing the multi-layered electronics module in a first region of a housing;
• disposing a second electronics module in a second region of the housing;
• separating the first region and the second region with a bulkhead;
• and
• coupling the second electronics module to the filter assembly of the first multi-layered electronics module so as to pass DC and low frequency signals between the modules and block RF signals.