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US 12,757,740 B2Granted
Single layer and multilayer magnetic inductors between substrate cores
AssigneeIntel Corporation
InventorsJianyong Xie, Andrew P. Collins, Arghya Sain, Sivaseetharaman Pandi, Telesphor Kamgaing
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Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a first layer that comprises glass. In an embodiment, a second layer comprising glass is over the first layer. In an embodiment, the electronic package further comprises an inductor between the first layer and the second layer.
Claims13
An electronic package, comprising:
- a first layer comprising glass;
- a second layer comprising glass over the first layer comprising glass;
- an inductor between the first layer comprising glass and the second layer comprising glass;
- and
- a magnetic material above and below the inductor, the magnetic material extending into the first layer comprising glass and extending into the second layer comprising glass.
2 more elements
Dependencies are inferred from the claim text.