H10W 44/501
Inductive arrangements
Official title: {Inductive arrangements (H10W44/20 takes precedence)}
H10W44/501 (Inductive arrangements) appears on 2,022 US grants and 2,492 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,022
- Published applications
- 2,492
- Assignees
- 575
- Inventors
- 4,073
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 10 | 0 |
| 1993 | 2 | 0 |
| 1994 | 11 | 0 |
| 1995 | 14 | 0 |
| 1996 | 14 | 0 |
| 1997 | 4 | 0 |
| 1998 | 16 | 0 |
| 1999 | 14 | 0 |
| 2000 | 22 | 0 |
| 2001 | 25 | 11 |
| 2002 | 39 | 52 |
| 2003 | 39 | 45 |
| 2004 | 34 | 50 |
| 2005 | 46 | 51 |
| 2006 | 29 | 31 |
| 2007 | 33 | 47 |
| 2008 | 25 | 64 |
| 2009 | 32 | 73 |
| 2010 | 58 | 87 |
| 2011 | 71 | 82 |
| 2012 | 76 | 77 |
| 2013 | 71 | 62 |
| 2014 | 77 | 87 |
| 2015 | 81 | 103 |
| 2016 | 85 | 80 |
| 2017 | 98 | 98 |
| 2018 | 103 | 120 |
| 2019 | 108 | 109 |
| 2020 | 97 | 142 |
| 2021 | 95 | 147 |
| 2022 | 118 | 148 |
| 2023 | 106 | 160 |
| 2024 | 119 | 204 |
| 2025 | 142 | 156 |
| 2026 | 91 | 206 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor module6 Oct 2026US 12,757,768 B2Shindengen Electric Manufacturing Co., Ltd.
- Semiconductor module6 Oct 2026US 12,757,769 B2Shindengen Electric Manufacturing Co., Ltd.
- Microelectronic assembly having antiferromagnetic film structure therein22 Sep 2026US 12,745,648 B2Intel Corporation
- Semiconductor device provided with insulating element bonded to insulating substrate22 Sep 2026US 12,745,655 B2Rohm Co., Ltd.
- U-shaped coil arrangement in a power stage module1 Oct 2026US 2026/0305364 A1Texas Instruments Incorporated
- Single layer and multilayer magnetic inductors between substrate cores1 Oct 2026US 2026/0305365 A1Intel Foundry IP LLC
- Electronic device having an integrated inductor coil1 Oct 2026US 2026/0305427 A1
- Multilayer core packages with coaxial magnetic inductor loops and embedded deep trench capacitors for voltage regulators1 Oct 2026US 2026/0305465 A1Intel Corporation
- Electrical interconnects for packages containing photonic integrated circuits1 Oct 2026US 2026/0305479 A1Sicily Merger Sub II, Inc.
Most cited
By later US patents
- Single chip transponder device415US 4,857,893 ABI Incorporated · 1989
- Linearity improvements of semiconductor substrate based radio frequency devices371US 7,868,419 B1RF Micro Devices, Inc. · 2011
- Circuit structure including a passive element formed within a grid array substrate and method for making the same370US 6,362,525 B1Cypress Semiconductor Corporation · 2002
- Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same291US 9,461,001 B1Advanced Semiconductor Engineering, Inc. · 2016
- High frequency chip packages with connecting elements238US 7,176,506 B2Tessera, Inc. · 2007