Multilayer core packages with coaxial magnetic inductor loops and embedded deep trench capacitors for voltage regulators

A microelectronic assembly, comprising:

• a first dielectric layer;
• a magnetic inductor integrated in the first dielectric layer;
• a second dielectric layer;
• a bonding interface between the first dielectric layer and the second dielectric layer;
• and
• a capacitor in a cavity in the second dielectric layer,
• wherein the magnetic inductor includes a first dielectric core extending from a first face to an opposite second face of the first dielectric layer, a layer of a first conductive material coaxial with the first dielectric core, a second dielectric core extending from the first face to the second face of the first dielectric layer, a layer of a second conductive material coaxial with the second dielectric core, and a magnetic material laterally surrounding the layer of the first conductive material and the layer of the second conductive material.

A multilayer substrate, comprising:

• a first stack of dielectric layers comprising conductive vias and conductive traces;
• a first additional dielectric layer;
• a second additional dielectric layer, wherein the first additional dielectric layer is between the first stack of dielectric layers and the second additional dielectric layer;
• a bonding interface between the first additional dielectric layer and the second additional dielectric layer;
• and
• a second stack of dielectric layers comprising conductive vias and conductive traces, wherein the second additional dielectric layer is between the first additional dielectric layer and the second stack of dielectric layers,
• wherein:
• the first additional dielectric layer includes a magnetic inductor,
• the second additional dielectric layer includes a capacitor, and
• the magnetic inductor and the capacitor are vertically stacked with respect to one another.