H10W 44/401
Resistive arrangements
Official title: {Resistive arrangements (H10W44/20, H10W42/80 take precedence)}
H10W44/401 (Resistive arrangements) appears on 330 US grants and 330 published applications in this corpus.
Search patents in H10W- Granted patents
- 330
- Published applications
- 330
- Assignees
- 190
- Inventors
- 835
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 1 | 0 |
| 1987 | 6 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 2 | 1 |
| 2002 | 9 | 3 |
| 2003 | 3 | 9 |
| 2004 | 9 | 7 |
| 2005 | 3 | 3 |
| 2006 | 1 | 2 |
| 2007 | 5 | 12 |
| 2008 | 6 | 16 |
| 2009 | 4 | 8 |
| 2010 | 2 | 7 |
| 2011 | 9 | 7 |
| 2012 | 10 | 5 |
| 2013 | 4 | 12 |
| 2014 | 12 | 11 |
| 2015 | 10 | 8 |
| 2016 | 11 | 11 |
| 2017 | 13 | 13 |
| 2018 | 15 | 12 |
| 2019 | 12 | 22 |
| 2020 | 8 | 19 |
| 2021 | 16 | 18 |
| 2022 | 22 | 23 |
| 2023 | 11 | 22 |
| 2024 | 21 | 28 |
| 2025 | 17 | 33 |
| 2026 | 12 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Power semiconductor module15 Sep 2026US 12,740,471 B2Sansha Electric Manufacturing Company, Limited
- Thin film resistor11 Aug 2026US 12,707,657 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device, method for manufacturing the semiconductor device, and power conversion device11 Aug 2026US 12,707,706 B2Hitachi Power Semiconductor Device, Ltd.
- Method of manufacturing an ipd-type electronic device24 Sep 2026US 2026/0293718 A1STMicroelectronics International N. V.
- Transfer molded module10 Sep 2026US 2026/0271738 A1Mitsubishi Electric Corporation
- Semiconductor integrated circuit13 Aug 2026US 2026/0239633 A1Rohm Co., Ltd.
- Semiconductor module and power conversion apparatus30 Jul 2026US 2026/0223756 A1Mitsubishi Electric Corporation
- Power module, electric power converter and electric drive for a mean of transport16 Jul 2026US 2026/0205029 A1Valeo eAutomotive Germany GmbH
Most cited
By later US patents
- Memory card having static electricity protection250US 4,532,419 ASony Corporation · 1985
- Passive interposer including at least one passive electronic component225US 5,530,288 AInternational Business Machines Corporation · 1996
- Power and ground plane structure for chip carrier187US 4,417,266 AAMP Incorporated · 1983
- Method for forming high performance system-on-chip using post passivation process163US 6,303,423 B1Megic Corporation · 2001
- Technique to reduce reflections and ringing on CMOS interconnections140US 6,552,564 B1Micron Technology, Inc. · 2003