Method of manufacturing an ipd-type electronic device

A method of manufacturing an electronic device of Integrated Passive Devices (IPD) type, wherein the method comprises steps of:

• a) providing a structure comprising:
• a substrate having a resistivity higher than 1 kΩ/cm with passive components being formed in the substrate or on a first surface of the substrate,
• an interconnection structure covering the first surface of the substrate and the passive components, the interconnection structure comprising a dielectric material in which are formed electrically-conductive tracks and connection areas, and the connection areas being covered by connection pads;
• b) from a second surface of the substrate, forming a via to reach an electrically-conductive track electrically connected to one of the connection areas or to reach one of the connection areas;
• c) filling the via with a solderable material;
• and
• d) performing a reflow to melt the solderable material and form a connection pad emerging from the second surface of the substrate.