Semiconductor module and power conversion apparatus
AssigneeMitsubishi Electric Corporation
InventorsDaichi YOSHO, Kazuto MIKAMI
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Abstract
A semiconductor module includes a first insulating substrate, a plurality of first semiconductor elements, and a conductive wire. The first insulating substrate includes a circuit pattern. The plurality of first semiconductor elements are arranged on the circuit pattern. The plurality of first semiconductor elements include a converter diode. The circuit pattern includes a main circuit pattern on which the converter diode is mounted and a signal circuit pattern electrically connected to a unit substrate. A length of the conductive wire between the converter diode and the signal circuit pattern is longer than a length of a longest side of the plurality of first semiconductor elements.
Claims6
A semiconductor module comprising:
- a first insulating substrate including an insulating layer including a main surface and a circuit pattern arranged on the main surface;
- a plurality of first semiconductor elements arranged on the circuit pattern;
- and
- a conductive wire, wherein
- the plurality of first semiconductor elements include a converter diode,
- the circuit pattern includes a main circuit pattern on which the converter diode is mounted and a signal circuit pattern electrically connected to a unit substrate,
- the conductive wire is bonded to the converter diode and the signal circuit pattern, and
- a length of the conductive wire between the converter diode and the signal circuit pattern is longer than a length of a longest side of the plurality of first semiconductor elements in a plan view of the main surface.
Dependencies are inferred from the claim text.