H10W 44/601
Capacitive arrangements
Official title: {Capacitive arrangements (H10W44/20 takes precedence)}
H10W44/601 (Capacitive arrangements) appears on 1,576 US grants and 1,699 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,576
- Published applications
- 1,699
- Assignees
- 474
- Inventors
- 3,466
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 11 | 0 |
| 1988 | 11 | 0 |
| 1989 | 10 | 0 |
| 1990 | 12 | 0 |
| 1991 | 18 | 0 |
| 1992 | 18 | 0 |
| 1993 | 18 | 0 |
| 1994 | 14 | 0 |
| 1995 | 20 | 0 |
| 1996 | 13 | 0 |
| 1997 | 28 | 0 |
| 1998 | 23 | 0 |
| 1999 | 15 | 0 |
| 2000 | 19 | 0 |
| 2001 | 23 | 15 |
| 2002 | 41 | 54 |
| 2003 | 30 | 45 |
| 2004 | 36 | 54 |
| 2005 | 39 | 47 |
| 2006 | 32 | 21 |
| 2007 | 32 | 39 |
| 2008 | 22 | 63 |
| 2009 | 28 | 36 |
| 2010 | 38 | 55 |
| 2011 | 52 | 44 |
| 2012 | 45 | 50 |
| 2013 | 44 | 52 |
| 2014 | 64 | 68 |
| 2015 | 57 | 60 |
| 2016 | 63 | 43 |
| 2017 | 62 | 50 |
| 2018 | 43 | 57 |
| 2019 | 69 | 71 |
| 2020 | 55 | 100 |
| 2021 | 77 | 109 |
| 2022 | 94 | 118 |
| 2023 | 82 | 112 |
| 2024 | 89 | 108 |
| 2025 | 72 | 137 |
| 2026 | 43 | 91 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Copper rings for BGA count reduction in small form factor packages6 Oct 2026US 12,757,801 B2Intel Corporation
- Package-on-package assembly containing a decoupling capacitor22 Sep 2026US 12,745,679 B2KYOCERA AVX Components Corporation
- Interposer with capacitors1 Sep 2026US 12,727,484 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Packages with chips comprising inductor-vias and methods forming the same25 Aug 2026US 12,720,775 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Energy harvest and storage device for semiconductor chips and methods for forming the same18 Aug 2026US 12,713,933 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Concentric dtc bumps for high density package decap solution8 Oct 2026US 2026/0313924 A1QUALCOMM Incorporated
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
- Electronic device with galvanic isolation and integration methods1 Oct 2026US 2026/0304793 A1Globalfoundries Singapore Pte. Ltd.
- Semiconductor device1 Oct 2026US 2026/0305366 A1Rohm Co., Ltd.
- Semiconductor device, module member, and circuit board1 Oct 2026US 2026/0305367 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Multichip semiconductor device, chip therefor and method of formation thereof309US 6,809,421 B1Kabushiki Kaisha Toshiba · 2004
- Apparatus for non-conductively interconnecting integrated circuits using half capacitors233US 5,629,838 APolychip, Inc. · 1997
- Passive interposer including at least one passive electronic component225US 5,530,288 AInternational Business Machines Corporation · 1996
- Non-optical signal isolator214US 6,873,065 B2Analog Devices, Inc. · 2005