Semiconductor device

Abstract

A semiconductor device includes a mounting substrate, a first semiconductor chip, and a second semiconductor chip. The first semiconductor chip is mounted on a first substrate surface of the mounting substrate. The second semiconductor chip is mounted on the first substrate surface of the mounting substrate at a gap from the first semiconductor. A plurality of first conductive layers are provided on the first substrate surface of the mounting substrate, and a plurality of second conductive layers are provided in the mounting substrate. The semiconductor device includes a first capacitor and a second capacitor that are electrically connected to the first semiconductor chip and the second semiconductor chip. The first capacitor and the second capacitor are constituted of the plurality of first conductive layers provided on the first substrate surface of the mounting substrate and the plurality of second conductive layers provided in the mounting substrate.

Dependencies are inferred from the claim text.