Interposer with capacitors

An interposer, comprising:

• a first conductive layer comprising a first area comprising a first signal line and a second signal line, wherein both the first signal line and the second signal line are positioned closer to a first surface of the interposer than a second surface of the interposer, the second surface being opposite of the first surface, and wherein a first integrated circuit is stacked on the first surface of the interposer and is connected to the interposer;
• a plurality of capacitors positioned comprising a first conductive plate and a second conductive plate parallel to the first conductive plate, wherein the first conductive plate is positioned closer to the first surface of the interposer than the second surface of the interposer and the second conductive plate is positioned closer to second surface of the interposer than the first surface of the interposer;
• a plurality of first connectors, a respective first connector of the plurality of first connectors connecting the first conductive plate of a respective capacitor of the plurality of capacitors to the first signal line in the first conductive layer;
• a plurality of second connectors, a respective second connector of the plurality of second connectors connecting the second conductive plate of the respective capacitor of the plurality of capacitors to the second signal line in the first conductive layer, and wherein:
• the plurality of first connectors are arranged to overlap and alternate with the plurality of second connectors along a first dimension of the interposer, wherein the first dimension extends perpendicular to a thickness direction of the interposer,
• each of the plurality of first connectors extend out from the first signal line along a second dimension of the interposer towards the second signal line, wherein the second dimension extends perpendicular to the first dimension and the thickness direction,
• each of the plurality of second connectors extends out from the second signal line along the second dimension of the interposer towards the first signal line;
• the first conductive layer further comprises a second area having a third signal line;
• one or more third connectors extend out in the second area from the first signal line along a third dimension towards the third signal line;
• and
• one or more fourth connectors extend out in the second area from the third signal line along the third dimension towards the first signal line.