Semiconductor device, module member, and circuit board
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshimasa YOSHIOKA, Hiroshi NAKAGAWA
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AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshimasa YOSHIOKA, Hiroshi NAKAGAWA
Estimating the term…
A semiconductor device capable of reducing the influence of noise on a capacitance section. The semiconductor device includes a semiconductor substrate having one main surface and another main surface spaced apart from the one main surface in a thickness direction and facing in an opposite direction from the one main surface in the thickness direction, the semiconductor substrate having at least one trench provided in the one main surface, and a hole provided so as to extend along the thickness direction, open in at least one of the one main surface and the other main surface, and have a larger area than one of the trenches when viewed along the thickness direction; a capacitance section provided at least inside the trench and including a dielectric layer and two electrode layers sandwiching the dielectric layer therebetween; and a filling portion provided inside the hole and containing a conductive material.
A semiconductor device comprising:
Dependencies are inferred from the claim text.