H10W 42/00
Arrangements for protection of devices
Official title: Arrangements for protection of devices (arrangements for thermal protection H10W40/00)
H10W42/00 (Arrangements for protection of devices) appears on 17,642 US grants and 21,359 published applications in this corpus.
Search patents in H10W- Granted patents
- 17,642
- Published applications
- 21,359
- Assignees
- 2,532
- Inventors
- 28,001
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 3 | 0 |
| 1978 | 9 | 0 |
| 1979 | 10 | 0 |
| 1980 | 3 | 0 |
| 1981 | 10 | 0 |
| 1982 | 14 | 0 |
| 1983 | 11 | 0 |
| 1984 | 26 | 0 |
| 1985 | 19 | 0 |
| 1986 | 27 | 0 |
| 1987 | 20 | 0 |
| 1988 | 13 | 0 |
| 1989 | 24 | 0 |
| 1990 | 31 | 0 |
| 1991 | 29 | 0 |
| 1992 | 43 | 0 |
| 1993 | 51 | 0 |
| 1994 | 67 | 0 |
| 1995 | 65 | 0 |
| 1996 | 72 | 0 |
| 1997 | 66 | 0 |
| 1998 | 112 | 0 |
| 1999 | 117 | 0 |
| 2000 | 133 | 0 |
| 2001 | 163 | 84 |
| 2002 | 203 | 276 |
| 2003 | 259 | 275 |
| 2004 | 252 | 358 |
| 2005 | 258 | 421 |
| 2006 | 273 | 401 |
| 2007 | 290 | 522 |
| 2008 | 273 | 546 |
| 2009 | 307 | 496 |
| 2010 | 420 | 500 |
| 2011 | 503 | 576 |
| 2012 | 461 | 583 |
| 2013 | 501 | 637 |
| 2014 | 660 | 809 |
| 2015 | 748 | 917 |
| 2016 | 881 | 936 |
| 2017 | 968 | 1064 |
| 2018 | 964 | 1146 |
| 2019 | 1095 | 1243 |
| 2020 | 1124 | 1430 |
| 2021 | 1090 | 1375 |
| 2022 | 1082 | 1441 |
| 2023 | 1106 | 1513 |
| 2024 | 1059 | 1442 |
| 2025 | 1058 | 1323 |
| 2026 | 663 | 1045 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 42/20Protecting against electromagnetic or particle radiation6,159
- H10W 42/121Protecting against mechanical damage5,651
- H10W 42/60Protecting against electrostatic charges or discharges1,990
- H10W 42/40Protecting against tampering1,210
- H10W 42/80Protecting against overcurrent or overload765
- H10W 42/101Protecting against moisture1
Recent patents
- Half-bridge circuit using monolithic flip-chip GAN power devices6 Oct 2026US 12,756,203 B2Navitas Semiconductor Limited
- Vertical memory devices6 Oct 2026US 12,757,401 B2Samsung Electronics Co., Ltd.
- Electrostatic discharge path for preventing plasma-induced damage during patterning of phase change material and method for forming the same6 Oct 2026US 12,757,643 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Workpiece tape removing6 Oct 2026US 12,757,673 B2Yangtze Memory Technologies Co., Ltd.
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Neutron radiation shielding material, shielding material for semiconductor device, package for semiconductor device, shielding material for nuclear reactor, nuclear reactor containment vessel, nuclear reactor building, shielding material for nuclear fusion reactor, nuclear fusion reactor, and nuclear fusion reactor building8 Oct 2026US 2026/0311898 A1Dexerials Corporation
- Semiconductor devices including guard ring structure and data storage systems including the same8 Oct 2026US 2026/0313905 A1Samsung Electronics Co., Ltd.
- Method for Separating a Layer of Solid Material from a Workpiece8 Oct 2026US 2026/0314345 A1Siltectra GmbH
- Semiconductor package with stacked members8 Oct 2026US 2026/0314415 A1Samsung Electronics Co., Ltd.
- Seal ring structure8 Oct 2026US 2026/0314416 A1GLOBALFOUNDRIES U. S. Inc.
Most cited
By later US patents
- Tamper respondent system1,284US 7,787,256 B2Gore Enterprise Holdings, Inc. · 2010
- Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices620US 8,877,554 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Interconnect structure for stacked semiconductor device573US 6,465,892 B1Fujitsu Limited · 2002
- Package semiconductor chip567US 4,862,245 AInternational Business Machines Corporation · 1989
- Semiconductor device and method for manufacturing the same536US 6,503,826 B1NEC Corporation · 2003