H10W 42/121
Protecting against mechanical damage
Official title: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
H10W42/121 (Protecting against mechanical damage) appears on 5,651 US grants and 7,862 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,651
- Published applications
- 7,862
- Assignees
- 877
- Inventors
- 10,552
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 5 | 0 |
| 1993 | 6 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 10 | 0 |
| 1997 | 6 | 0 |
| 1998 | 9 | 0 |
| 1999 | 10 | 0 |
| 2000 | 9 | 0 |
| 2001 | 20 | 7 |
| 2002 | 21 | 43 |
| 2003 | 28 | 42 |
| 2004 | 42 | 51 |
| 2005 | 37 | 96 |
| 2006 | 46 | 83 |
| 2007 | 58 | 84 |
| 2008 | 51 | 95 |
| 2009 | 53 | 97 |
| 2010 | 81 | 99 |
| 2011 | 90 | 133 |
| 2012 | 80 | 145 |
| 2013 | 125 | 181 |
| 2014 | 191 | 279 |
| 2015 | 228 | 301 |
| 2016 | 283 | 366 |
| 2017 | 375 | 385 |
| 2018 | 347 | 416 |
| 2019 | 374 | 477 |
| 2020 | 433 | 562 |
| 2021 | 416 | 588 |
| 2022 | 448 | 672 |
| 2023 | 499 | 705 |
| 2024 | 459 | 690 |
| 2025 | 491 | 673 |
| 2026 | 292 | 592 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
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- Chip scale packages and methods for manufacturing the chip scale packages at wafer level220US 6,187,615 B1Samsung Electronics Co., Ltd. · 2001
- Method to fill the gap between coupled wafers219US 7,087,538 B2Intel Corporation · 2006
- Semiconductor device package and method215US 8,941,248 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015