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US 7,087,538 B2Granted
Method to fill the gap between coupled wafers
AssigneeIntel Corporation
InventorsDavid Staines, Grant M. Kloster, Shriram Ramanathan
Life of this patent
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Abstract
A three-dimensional integrated circuit formed by applying a material to fill a gap between coupled wafers and slicing the coupled wafers into dice. A method for filling a gap between coupled wafers. Various embodiments include at least one of spinning a coupled wafer pair, drilling a hole into one of the coupled wafers, and using a vacuum to aid in the dispersion of the material.
Claims63
A process, comprising:
- spinning a first wafer bonded to a second wafer at a first spin speed, said first wafer positioned above said second wafer to form a gap between said bonded first and second wafers;
- and
- applying a material on a top surface of said first wafer until said material flows to an edge of said first wafer enabling said material to flow into said gap between said bonded first and second wafers.
A process, comprising:
- creating a hole in a center of a first wafer;
- bonding said first wafer to a second wafer to create a bonded wafer pair;
- applying a polymer material through said hole to cause said material to flow through said hole and into a gap between said bonded wafer pair;
- and
- curing said material.
2 more elements
A wafer coupling method, comprising:
- spinning a set of coupled wafers;
- creating a pressure differential between a hole in at least one of the coupled wafers and a gap between the coupled wafers;
- causing a material to fill said gap by spreading said material through said coupled wafers because of said pressure differential;
- and
- curing said material.
2 more elements
A wafer coupling method, comprising:
- creating a hole in a center of a first wafer;
- coupling said first wafer to a second wafer to create a coupled wafer pair;
- spinning said coupled wafer pair;
- applying a vacuum at said hole;
- applying a material directly into a gap between said coupled wafer pair;
- attracting said material toward said hole of said coupled wafer pair through said gap by applying said vacuum at said hole;
- and
- curing said material.
5 more elements
A wafer coupling method, comprising:
- coupling a first wafer to a second wafer to create a coupled wafer pair;
- spinning said coupled wafer pair;
- applying a vacuum directly in a gap between said coupled wafer pair;
- applying a material on top of said coupled wafer pair causing said material to flow through a hole through said first wafer of said coupled wafer pair;
- attracting said material toward said gap by creating a pressure differential between said hole and said gap;
- and
- curing said material.
4 more elements
A three-dimensional (3-D) integrated chip system, comprising:
- a first wafer having a hole in a center of said first wafer;
- a second wafer that is bonded to said first wafer, creating a bonded wafer pair;
- and
- a material within a gap created when said bonded wafer pair is created, said gap between said first wafer and said second wafer in said bonded wafer pair.
1 more element
Dependencies are inferred from the claim text.