Tamper respondent system
AssigneeGore Enterprise Holdings, Inc.
InventorsKarl Chan, Brent Lewis, Harold Wylie, Dale Murray
Life of this patent
Estimating the term…
Abstract
A tamper respondent system having: a physical volume containing an electronic device to be protected; an at least partially conductive surface proximate to the electronic device; and a tamper respondent sensor over the electronic device (the sensor comprising: a flexible, dielectric substrate; conductive traces on the substrate; a porous insulating layer having pores over the conductive traces; and adhesive within said pores of said porous insulating layer), wherein the adhesive is in contact with both the substrate and the at least partially conductive surface through the porous insulating layer.
Claims9
A tamper respondent system comprising:
- (a) an article to be protected;
- (b) a surface proximate to said article;
- (c) a tamper respondent sensor between said article and said surface, said sensor comprising:
- i. a flexible, dielectric substrate;
- ii. conductive traces on said substrate;
- and
- iii. a porous insulating layer having pores over said conductive traces;
- (d) an adhesive comprising a combination of epoxy and a pressure sensitive adhesive within said pores of said porous insulating layer,
- (e) wherein said adhesive is in contact with both said substrate and said surface through said porous insulating layer.
Dependencies are inferred from the claim text.