H10W 95/00
Packaging processes not covered by the other groups of this subclass
H10W95/00 (Packaging processes not covered by the other groups of this subclass) appears on 2,031 US grants and 2,173 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,031
- Published applications
- 2,173
- Assignees
- 732
- Inventors
- 4,211
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 5 | 0 |
| 1978 | 7 | 0 |
| 1979 | 6 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 10 | 0 |
| 1983 | 5 | 0 |
| 1984 | 8 | 0 |
| 1985 | 7 | 0 |
| 1986 | 7 | 0 |
| 1987 | 11 | 0 |
| 1988 | 4 | 0 |
| 1989 | 14 | 0 |
| 1990 | 8 | 0 |
| 1991 | 17 | 0 |
| 1992 | 17 | 0 |
| 1993 | 18 | 0 |
| 1994 | 12 | 0 |
| 1995 | 15 | 0 |
| 1996 | 12 | 0 |
| 1997 | 11 | 0 |
| 1998 | 15 | 0 |
| 1999 | 22 | 0 |
| 2000 | 17 | 0 |
| 2001 | 18 | 11 |
| 2002 | 28 | 33 |
| 2003 | 17 | 28 |
| 2004 | 33 | 56 |
| 2005 | 36 | 59 |
| 2006 | 39 | 57 |
| 2007 | 42 | 49 |
| 2008 | 26 | 53 |
| 2009 | 36 | 41 |
| 2010 | 37 | 54 |
| 2011 | 47 | 76 |
| 2012 | 55 | 74 |
| 2013 | 106 | 184 |
| 2014 | 129 | 196 |
| 2015 | 146 | 124 |
| 2016 | 135 | 93 |
| 2017 | 100 | 72 |
| 2018 | 89 | 78 |
| 2019 | 75 | 90 |
| 2020 | 83 | 121 |
| 2021 | 81 | 145 |
| 2022 | 112 | 128 |
| 2023 | 92 | 112 |
| 2024 | 99 | 96 |
| 2025 | 67 | 81 |
| 2026 | 40 | 62 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor assemblies with system and methods for aligning dies using registration marks29 Sep 2026US 12,751,341 B2Micron Technology, Inc.
- Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium8 Sep 2026US 12,733,455 B2Yamaha Robotics Co., Ltd.
- Semiconductor device package and method for manufacturing the same8 Sep 2026US 12,733,503 B2Advanced Semiconductor Engineering, Inc.
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Integrated assemblies, and methods of forming integrated assemblies25 Aug 2026US 12,718,847 B2Micron Technology, Inc.
- Pin control device, pin insertion device, remaining pin removal device, pin insertion method and remaining pin removal method1 Oct 2026US 2026/0305433 A1
- Method for manufacturing semiconductor device1 Oct 2026US 2026/0305461 A1Resonac Corporation
- Semiconductor device and manufacturing method of the same1 Oct 2026US 2026/0305475 A1Kioxia Corporation
- Semiconductor package and methods for forming the same17 Sep 2026US 2026/0282897 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and manufacturing method thereof17 Sep 2026US 2026/0282898 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Leadless image sensor package structure and method for making the same353US 6,384,472 B1Siliconware Precision Industries Co., Ltd. · 2002
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001
- Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same275US 8,802,495 B2Samsung Electronics Co., Ltd. · 2014
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Conductive barrier direct hybrid bonding254US 9,953,941 B2Invensas Bonding Technologies, Inc. · 2018