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US 2026/0282898 A1Published application
Package structure and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWensen Hung, Kris Lipu Chuang
Life of this patent
Estimating the term…
Abstract
A device includes a semiconductor package including a first side and a second side opposite to each other, a substrate coupled to the second side of the semiconductor package, and a lid coupled to the substrate and the first side of the semiconductor package. The lid includes a first surface and a second surface opposite to each other, the second surface faces the semiconductor package, and the first surface is flatter than the second surface.
Claims20
A device, comprising:
- a semiconductor package comprising a first side and a second side opposite to each other;
- a substrate coupled to the second side of the semiconductor package;
- and
- a lid coupled to the substrate and the first side of the semiconductor package, the lid comprising a first surface and a second surface opposite to each other, the second surface facing the semiconductor package, the first surface being flatter than the second surface.
1 more element
A device, comprising:
- a substrate;
- a semiconductor package disposed on the substrate, the semiconductor package comprising semiconductor dies laterally covered by an encapsulant;
- and
- a lid disposed on the substrate, the lid comprising a plate portion covering the semiconductor package and a foot portion connecting the plate portion to the substrate, and the plate portion comprising a varying thickness.
1 more element
A method, comprising:
- coupling a semiconductor package to a substrate;
- attaching a lid to the substrate and the semiconductor package, wherein the lid comprises a top surface and a bottom surface facing the semiconductor package;
- and
- flattening the lid, wherein after flattening the lid, a flattened top surface of the lid is flatter than the bottom surface.
1 more element
Dependencies are inferred from the claim text.