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US 2026/0305475 A1Published application
Semiconductor device and manufacturing method of the same
AssigneeKioxia Corporation
InventorsTakeori MAEDA, Soichi HOMMA
Life of this patent
Estimating the term…
Abstract
According to one or more embodiments, a semiconductor device includes a support having a recess. A plurality of semiconductor chips are stacked on each other in the recess. A plurality of columnar electrodes in the recess extend from the semiconductor chips toward an opening of the support. A wiring layer is disposed over the opening. The recess is filled with an insulating material to cover the semiconductor chips and the columnar electrodes.
Claims20
A semiconductor device, comprising:
- a support comprising a recess, a bottom portion, and a side portion on the bottom portion and surrounding the recess;
- a plurality of semiconductor chips in the recess, the semiconductor chips being stacked in tiers and displaced from one another;
- a plurality of columnar electrodes in the recess, the columnar electrodes extending from the semiconductor chips toward an opening of the support;
- a wiring layer over the opening of the support;
- and
- an insulating material filling the recess and covering the semiconductor chips and the columnar electrodes, wherein
- the bottom portion and the side portion of the support are integrally formed portions of a same material, and
- an uppermost surface of the insulating material and an uppermost surface of the side portion are coplanar.
5 more elements
Dependencies are inferred from the claim text.