Semiconductor device package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsZheng Wei Wu, Cheng Kai Chang
Life of this patent
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Abstract
The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface, an electrical contact disposed over a first region of the substrate, and an EMI shielding layer disposed over the substrate. The EMI shielding layer includes a non-uniform thickness and an elevation of the EMI shielding layer is higher than an elevation of the electrical contact with respect to the first surface of the substrate. A method for manufacturing a semiconductor device package is also disclosed.
Claims20
A semiconductor device package, comprising:
- a substrate having a first surface;
- a plurality of antennas embedded in the substrate, wherein the plurality of antennas have different operating frequencies;
- a dielectric layer disposed over the first surface of the substrate and defining an opening, wherein a conductive pad is exposed from the opening and overlapped with one of the plurality of antennas in a direction substantially perpendicular to the first surface of the substrate;
- and
- an EMI shielding layer disposed over the first surface of the substrate, wherein the EMI shielding layer contacts both the conductive pad and the dielectric layer, and wherein the EMI shielding layer is disposed along a contour of an edge of the dielectric layer.
A semiconductor device package, comprising:
- a substrate having a first surface;
- a dielectric layer disposed over the first surface of the substrate and defining an opening;
- a grounding structure exposed from the opening;
- and
- an EMI shielding layer disposed over the first surface of the substrate, wherein at least a portion of the EMI shielding layer comprises a non-uniform thickness and in contact with the grounding structure,
- wherein the EMI shielding layer is disposed along a contour of an edge of the dielectric layer, and
- wherein the portion of the EMI shielding layer has a roughness greater than that of other portions of the EMI shielding layer and has a tapering profile, and wherein the portion of the EMI shielding layer is configured to conduct electromagnetic waves transmitted to or from an antenna element.
A semiconductor device package, comprising:
- a substrate having a first surface;
- a dielectric layer disposed over the first surface of the substrate and defining an opening, wherein a conductive pad is exposed from the opening;
- and
- an EMI shielding layer disposed over the first surface of the substrate, wherein the EMI shielding layer contacts both the conductive pad and the dielectric layer, and wherein the EMI shielding layer is disposed along a contour of an edge of the dielectric layer,
- wherein the EMI shielding layer has a first portion tapering from a top surface of the conductive pad toward a top surface of the dielectric layer, and a second portion tapering away from the edge of the dielectric layer.
Dependencies are inferred from the claim text.