Semiconductor assemblies with system and methods for aligning dies using registration marks
AssigneeMicron Technology, Inc.
InventorShiro Uchiyama
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Abstract
Semiconductor device assemblies having features that are used to align semiconductor dies, and associated systems and methods, are disclose herein. In some embodiments, a semiconductor device assembly includes substrate that has a top surface and an alignment structure at the top surface. A first die is disposed over the top surface of the substrate, and the first die has a first channel that extends between a top side and a bottom side of the first die. The first channel is vertically aligned with and exposes the alignment structure at the top surface of the substrate.
Claims8
A method for aligning semiconductor dies in a die stack, comprising:
- providing a first die with a first channel that extends between a top side and a bottom side of the first die;
- repositioning the first die relative to a substrate to expose an alignment structure of the substrate through the first channel;
- and
- mounting the first die to the substrate.
Dependencies are inferred from the claim text.