H10W 72/00
Interconnections or connectors in packages
H10W72/00 (Interconnections or connectors in packages) appears on 98,445 US grants and 108,596 published applications in this corpus.
Search patents in H10W- Granted patents
- 98,445
- Published applications
- 108,596
- Assignees
- 7,982
- Inventors
- 92,720
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 127 | 0 |
| 1977 | 129 | 0 |
| 1978 | 97 | 0 |
| 1979 | 66 | 0 |
| 1980 | 99 | 0 |
| 1981 | 88 | 0 |
| 1982 | 95 | 0 |
| 1983 | 106 | 0 |
| 1984 | 118 | 0 |
| 1985 | 150 | 0 |
| 1986 | 148 | 0 |
| 1987 | 213 | 0 |
| 1988 | 221 | 0 |
| 1989 | 318 | 0 |
| 1990 | 357 | 0 |
| 1991 | 496 | 0 |
| 1992 | 490 | 0 |
| 1993 | 519 | 0 |
| 1994 | 649 | 0 |
| 1995 | 652 | 0 |
| 1996 | 705 | 0 |
| 1997 | 807 | 0 |
| 1998 | 1190 | 0 |
| 1999 | 1365 | 0 |
| 2000 | 1563 | 0 |
| 2001 | 1994 | 993 |
| 2002 | 2217 | 2775 |
| 2003 | 2452 | 2876 |
| 2004 | 2470 | 3298 |
| 2005 | 2338 | 3923 |
| 2006 | 2511 | 3847 |
| 2007 | 2462 | 4150 |
| 2008 | 2244 | 4424 |
| 2009 | 2445 | 4309 |
| 2010 | 3423 | 4180 |
| 2011 | 3688 | 4216 |
| 2012 | 3635 | 4343 |
| 2013 | 3929 | 4387 |
| 2014 | 4288 | 4766 |
| 2015 | 4429 | 5072 |
| 2016 | 4577 | 4486 |
| 2017 | 4602 | 4511 |
| 2018 | 4084 | 4308 |
| 2019 | 4332 | 4629 |
| 2020 | 4297 | 5174 |
| 2021 | 3930 | 4950 |
| 2022 | 3799 | 4942 |
| 2023 | 3818 | 4922 |
| 2024 | 3691 | 5523 |
| 2025 | 3514 | 4654 |
| 2026 | 2508 | 2938 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/071Connecting or disconnecting52,421
- H10W 72/90Bond pads, in general45,156
- H10W 72/20Bump connectors39,198
- H10W 72/01Manufacture or treatment37,402
- H10W 72/851Dispositions of multiple connectors or interconnections35,662
- H10W 72/50Bond wires35,102
- H10W 72/30Die-attach connectors19,034
- H10W 72/60Strap connectors2,647
All 14 subgroupsShow fewer
- H10W 72/823Interconnections through encapsulations1,928
- H10W 72/701Tape-automated bond [tab] connectors1,000
- H10W 72/834Interconnections on sidewalls of chips793
- H10W 72/801Interconnections on sidewalls of containers290
- H10W 72/40Anisotropic conductive adhesives0
- H10W 72/812Interconnections on sidewalls of encapsulations0
Recent patents
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Semiconductor memory device6 Oct 2026US 12,757,413 B2Samsung Electronics Co., Ltd.
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Electronic device and manufacturing method of electronic device6 Oct 2026US 12,757,487 B2Innolux Corporation
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package manufacturing methods using hybrid die bonding with spin-on siloxane materials8 Oct 2026US 2026/0308432 A1
- Semiconductor devices configured for repairing defective bumps8 Oct 2026US 2026/0309777 A1SK hynix Inc.
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Semiconductor devices with photonic interconnect platforms and crossbar switches8 Oct 2026US 2026/0309948 A1
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- System and methods for converting planar design to FinFET design1,326US 8,816,444 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014