H10W 72/30
Die-attach connectors
H10W72/30 (Die-attach connectors) appears on 19,034 US grants and 22,246 published applications in this corpus.
Search patents in H10W- Granted patents
- 19,034
- Published applications
- 22,246
- Assignees
- 2,553
- Inventors
- 26,615
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 20 | 0 |
| 1977 | 23 | 0 |
| 1978 | 13 | 0 |
| 1979 | 10 | 0 |
| 1980 | 18 | 0 |
| 1981 | 15 | 0 |
| 1982 | 21 | 0 |
| 1983 | 16 | 0 |
| 1984 | 19 | 0 |
| 1985 | 25 | 0 |
| 1986 | 24 | 0 |
| 1987 | 27 | 0 |
| 1988 | 28 | 0 |
| 1989 | 54 | 0 |
| 1990 | 49 | 0 |
| 1991 | 68 | 0 |
| 1992 | 63 | 0 |
| 1993 | 61 | 0 |
| 1994 | 89 | 0 |
| 1995 | 80 | 0 |
| 1996 | 98 | 0 |
| 1997 | 112 | 0 |
| 1998 | 191 | 0 |
| 1999 | 202 | 0 |
| 2000 | 266 | 0 |
| 2001 | 333 | 159 |
| 2002 | 310 | 446 |
| 2003 | 338 | 381 |
| 2004 | 355 | 461 |
| 2005 | 351 | 546 |
| 2006 | 360 | 516 |
| 2007 | 318 | 589 |
| 2008 | 297 | 621 |
| 2009 | 333 | 647 |
| 2010 | 496 | 677 |
| 2011 | 538 | 776 |
| 2012 | 593 | 818 |
| 2013 | 723 | 790 |
| 2014 | 744 | 869 |
| 2015 | 820 | 969 |
| 2016 | 866 | 985 |
| 2017 | 922 | 969 |
| 2018 | 846 | 993 |
| 2019 | 1014 | 1273 |
| 2020 | 1137 | 1582 |
| 2021 | 1062 | 1406 |
| 2022 | 1106 | 1326 |
| 2023 | 1022 | 1195 |
| 2024 | 974 | 1585 |
| 2025 | 876 | 1074 |
| 2026 | 708 | 593 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/351Materials of die-attach connectors12,514
- H10W 72/321Structures or relative sizes of die-attach connectors6,472
- H10W 72/341Dispositions of die-attach connectors2,818
- H10W 72/381Auxiliary members1,858
- H10W 72/331Shapes of die-attach connectors1,729
- H10W 72/361Functions of die-attach connectors, other than mechanically connecting68
Recent patents
- Bonding layers formed of high thermal conductivity materials6 Oct 2026US 12,757,732 B2APPLIED Materials.Inc.
- Packaging structure having organic interposer layer and method for manufacturing same6 Oct 2026US 12,757,749 B2SJ Semiconductor(Jiangyin) Corporation
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Chiplet-fine-interconnection-package structure and method of manufacturing the same6 Oct 2026US 12,757,767 B2Institute of Semiconductors, Guangdong Academy of Sciences
- Semiconductor package manufacturing methods using hybrid die bonding with spin-on siloxane materials8 Oct 2026US 2026/0308432 A1
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009