H10W 72/381
Auxiliary members
Official title: {Auxiliary members}
H10W72/381 (Auxiliary members) appears on 1,858 US grants and 2,067 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,858
- Published applications
- 2,067
- Assignees
- 491
- Inventors
- 3,962
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 7 | 0 |
| 1990 | 9 | 0 |
| 1991 | 11 | 0 |
| 1992 | 9 | 0 |
| 1993 | 9 | 0 |
| 1994 | 18 | 0 |
| 1995 | 14 | 0 |
| 1996 | 18 | 0 |
| 1997 | 14 | 0 |
| 1998 | 15 | 0 |
| 1999 | 19 | 0 |
| 2000 | 33 | 0 |
| 2001 | 24 | 15 |
| 2002 | 36 | 57 |
| 2003 | 31 | 44 |
| 2004 | 47 | 62 |
| 2005 | 47 | 73 |
| 2006 | 38 | 51 |
| 2007 | 46 | 61 |
| 2008 | 44 | 78 |
| 2009 | 24 | 55 |
| 2010 | 51 | 58 |
| 2011 | 52 | 69 |
| 2012 | 53 | 78 |
| 2013 | 82 | 82 |
| 2014 | 72 | 97 |
| 2015 | 76 | 89 |
| 2016 | 83 | 87 |
| 2017 | 87 | 96 |
| 2018 | 84 | 105 |
| 2019 | 107 | 136 |
| 2020 | 115 | 133 |
| 2021 | 102 | 131 |
| 2022 | 102 | 95 |
| 2023 | 80 | 81 |
| 2024 | 84 | 95 |
| 2025 | 59 | 87 |
| 2026 | 41 | 52 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Submounts with stud protrusions for semiconductor packages29 Sep 2026US 12,751,305 B2
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor chip, semiconductor device, and semiconductor package including the same29 Sep 2026US 12,751,331 B2Samsung Electronics Co., Ltd.
- Packaged integrated circuit devices with enhanced dam structures that provide increased yield and reliability29 Sep 2026US 12,751,338 B2Samsung Electronics Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Thermal interface material bleed control for heat spreaders1 Oct 2026US 2026/0305388 A1Intel Corporation
- Semiconductor device24 Sep 2026US 2026/0293727 A1Denso Corporation
- Underfill adhesive flow control using dam structure24 Sep 2026US 2026/0293738 A1QUALCOMM Incorporated
- Micro-electro-mechanical system package17 Sep 2026US 2026/0274649 A1Vanguard International Semiconductor Corporation
Most cited
By later US patents
- Method for manufacturing wafer level chip stack package329US 7,151,009 B2Samsung Electronics Co., Ltd. · 2006
- Process for packaging a semiconductor die using dicing and testing302US 5,851,845 AMicron Technology, Inc. · 1998
- Sensor mounted in flip-chip technology on a substrate274US 8,791,532 B2Sensirion AG · 2014
- Molded plastic semiconductor package including heat spreader268US 5,608,267 AOlin Corporation · 1997
- Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly253US 6,285,075 B1ASAT Ltd. · 2001