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US 2026/0305388 A1Published application
Thermal interface material bleed control for heat spreaders
AssigneeIntel Corporation
InventorsEmilio TARANGO VALLES, Sergio Antonio CHAN ARGUEDAS, Aravindha ANTONISWAMY
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Abstract
Assemblies comprising heat spreaders, a metallic thermal interface material, semiconductor chips, and package substrates are provided wherein the solder interface material has not been reflowed onto a surface of the package substrate.
Claims19
An assembly comprising:
- a semiconductor chip;
- a package substrate wherein the semiconductor chip is coupled to the package substrate;
- thermal interface material on a surface of the semiconductor chip wherein the thermal interface material is a metallic material;
- a heat spreader wherein the heat spreader comprises a cavity and the thermal interface material is in the cavity, wherein the cavity has an opening, wherein opening is same footprint or larger than a footprint of the semiconductor chip, and wherein the opening is aligned with the footprint of the semiconductor chip.
1 more element
An assembly comprising:
- a semiconductor chip;
- a package substrate wherein the semiconductor chip is coupled to the package substrate;
- thermal interface material on a surface of the semiconductor chip wherein the thermal interface material is a metallic material;
- a heat spreader wherein the heat spreader comprises a trench, wherein the thermal interface material is in the trench, wherein the trench has a picture frame shape, wherein the picture frame shape aligns with edges of the semiconductor chip.
1 more element
An assembly comprising:
- a semiconductor chip;
- a package substrate wherein the semiconductor chip is coupled to the package substrate;
- thermal interface material on a surface of the semiconductor chip wherein the thermal interface material is a metallic material;
- a heat spreader wherein the heat spreader comprises a protuberance, wherein the thermal interface material is within a region outlined by the protuberance, wherein the protuberance has a picture frame shape, wherein the picture frame shape aligns with edges of the semiconductor chip.
1 more element
Dependencies are inferred from the claim text.