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US 6,285,075 B1Granted
Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly
AssigneeASAT Ltd.
InventorsEdward G. Combs, Robert Sheppard
Life of this patent
Estimating the term…
Abstract
An integrated circuit package includes a ceramic ring having an inside cavity for accommodating a semiconductor die. Conductive traces are provided on the ceramic ring so as to serve as power and ground signal busses. Power and ground connection pads on the semiconductor die can be commonly bonded to these conductive traces, which are in turn commonly bonded to selected pins of the lead frame. In addition, an acrylic adhesive is used as a moisture-resistant adhesive.
Claims19
A integrated circuit package, comprising:
- a heat spreader;
- a semiconductor die having a plurality of connection pads, said semiconductor die attached to said heat spreader by an adhesive;
- a plurality of leads each including an internal portion for bonding and an external portion to serve as an external terminal for said integrated circuit package;
- a plurality of bond wires each bonding one of said internal portions of said plurality of leads to one of said connection pads, for electrically connecting said connection pads of said semiconductor die to said plurality of leads;
- a ceramic ring enclosing said semiconductor die and attached to said heat spreader using an acrylic adhesive, said ceramic ring having provided thereon conductive traces for bonding, wherein a first one of said bond wires electrically couples one of said conductive traces of said ceramic ring to said internal portion of one said plurality of leads, and a second one of said bond wires electrically couples said one of said conductive traces of said ceramic rind to one of said connection pads;
- and
- a resin encapsulation enclosing said heat spreader, said semiconductor die, said internal portions of said plurality of leads and said plurality of bond wires.
4 more elements
An integrated circuit package, comprising:
- a die-attach pad;
- a semiconductor die having a plurality of connection pads, said semiconductor die attached to said die-attach pad by an adhesive;
- a plurality of leads each including an internal portion for bonding and an external portion to serve as an external terminal for said integrated circuit package;
- a downset interposer ring attached by an acrylic adhesive to said die-attach pad, said downset interposer having a segment positioned between said internal portion of one of said plurality of leads and said semiconductor die;
- a plurality of bond wires each electrically coupling one of said internal portions of said plurality of leads to one of said connection pads, wherein a first one of said bond wires electrically coupling said segment of said interposer ring to said internal portion of said plurality of leads and wherein a second bond wire electrically coupling said segment of said interposer ring to one of said connection pads;
- and
- a resin encapsulation enclosing said die-attach pad, said semiconductor die, said internal portions of said plurality of leads and said plurality of bond wires.
4 more elements
Dependencies are inferred from the claim text.