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US 2026/0293738 A1Published application
Underfill adhesive flow control using dam structure
AssigneeQUALCOMM Incorporated
InventorsTae Wan KIM, Jaekyu SONG, Rajneesh KUMAR
Life of this patent
Estimating the term…
Abstract
Disclosed are semiconductor packages. In one or more aspects, a dam support may be provided on a substrate of a semiconductor package. The dam support may be placed on edge of the saw street of the semiconductor package. In this way, underfill undercut can be minimized or even prevented altogether.
Claims16
A semiconductor package, comprising:
- a die on a substrate;
- an underfill (UF) between the die and the substrate;
- a dam support on the substrate and on a side of the underfill;
- and
- a mold on the underfill and the dam support,
- wherein the mold encapsulates sides of the die, and
- wherein sides of the dam support, the substrate, and the mold define a side of the semiconductor package.
4 more elements
A method of fabricating a semiconductor package, the method comprising:
- providing a die on a substrate;
- forming an underfill (UF) between the die and the substrate;
- forming a dam support on the substrate and on a side of the underfill;
- and
- forming a mold on the underfill and the dam support,
- wherein the mold encapsulates sides of the die, and
- wherein sides of the dam support, the substrate, and the mold define a side of the semiconductor package.
4 more elements
Dependencies are inferred from the claim text.