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US 5,608,267 AGranted
Molded plastic semiconductor package including heat spreader
AssigneeOlin Corporation
InventorsDeepak Mahulikar, Derek E. Tyler, Jeffrey S. Braden, James M. Popplewell
Life of this patent
Estimating the term…
Abstract
There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.
Claims20
A semiconductor package, comprising:
- at least one semiconductor device bonded to a first side of a thermal dissipator;
- said thermal dissipator having a first side and an opposing second side and being selected from the group consisting of aluminum, titanium, zinc, magnesium and alloys thereof with a density less than 5 g/cm.sup.3 ;
- an anodization layer coating said thermal dissipator;
- a leadframe providing electrical interconnection between said semiconductor device and the exterior of said semiconductor package wherein the thickness of said thermal dissipator is greater than the thickness of said leadframe;
- and
- a molding resin encapsulating said semiconductor device and at least a portion of said thermal dissipator.
3 more elements
A semiconductor package, comprising:
- at least one semiconductor device bonded to a first side of a thermal dissipator;
- said thermal dissipator being a metal/ceramic composite having a density of less than 5 g/cm.sup.3 and having a first side and an opposing second side;
- a leadframe providing electrical interconnection between said semiconductor device and the exterior of said semiconductor package wherein the thickness of said thermal dissipator is greater than the thickness of said leadframe;
- and
- a molding resin encapsulating said semiconductor device and at least a portion of said thermal dissipator.
2 more elements
A semiconductor package, comprising:
- at least one semiconductor device bonded to a first side of a thermal dissipator;
- said thermal dissipator being formed from a polymer matrix containing thermally conductive fibers and having a first side and an opposing second side;
- a leadframe providing electrical interconnection between said semiconductor device and the exterior of said semiconductor package wherein the thickness of said thermal dissipator is greater than the thickness of said leadframe;
- and
- a molding resin encapsulating said semiconductor device and at least a portion of said thermal dissipator.
2 more elements
A semiconductor package, comprising:
- at least one semiconductor device bonded to a first side of a thermal dissipator;
- said thermal dissipator being a metal or metal alloy coated with an electrically nonconductive layer selected from the group consisting of oxides and diamond films, said thermal dissipator having a first side and an opposing second side;
- a leadframe providing electrical interconnection between said semiconductor device and the exterior of said semiconductor package wherein the thickness of said thermal dissipator is greater than the thickness of said leadframe;
- and
- a molding resin encapsulating said semiconductor device and at least a portion of said thermal dissipator.
2 more elements
A semiconductor package, comprising:
- at least one semiconductor device bonded to a first side of a thermal dissipator;
- said thermal dissipator being a metal or metal alloy coated with a corrosion resistant layer selected from the group consisting of carbides, nitrides and carbonitrides, said thermal dissipator having a first side and an opposing second side;
- a leadframe providing electrical interconnection between said semiconductor device and the exterior of said semiconductor package wherein the thickness of said thermal dissipator is greater than the thickness of said leadframe;
- and
- a molding resin encapsulating said semiconductor device and at least a portion of said thermal dissipator.
2 more elements
A semiconductor package, comprising:
- at least one semiconductor device;
- a metallic heat spreader at least partially coated with an electrically isolating adhesion enhancing layer;
- an electrical interconnection selected from the group consisting of conductive vias and terminal pins between said semiconductor device and the exterior of said semiconductor package;
- and
- a molding resin encapsulating said semiconductor device, a portion of said conductive vias or terminal pins and a portion of said metallic heat spreader.
2 more elements
Dependencies are inferred from the claim text.