Semiconductor device

A semiconductor device comprising:

• a first substrate and a second substrate facing the first substrate, each of the first substrate and the second substrate including:
• an insulating base material,
• a front surface metal body disposed on a front surface of the insulating base material, and
• a back surface metal body disposed on a back surface of the insulating base material;
• a semiconductor element including a first semiconductor element and a second semiconductor element, the first semiconductor element and the second semiconductor element being arranged along a lateral direction, each of the first semiconductor element and the second semiconductor element being electrically connected to the front surface metal body of the first substrate and to the front surface metal body of the second substrate;
• a joint portion electrically connecting the front surface metal body of the first substrate and the front surface metal body of the second substrate;
• at least one spacer disposed between at least one of the first semiconductor element or the second semiconductor element and the second substrate in a thickness direction of the at least one of the first semiconductor element or the second semiconductor element, the at least one spacer providing a current conduction path between the at least one of the first semiconductor element or the second semiconductor element and the front surface metal body of the second substrate;
• and
• a sealing body sealing the first substrate, the second substrate, the first semiconductor element, the second semiconductor element, the joint portion, and the at least one spacer, wherein
• the insulating base material of at least one of the first substrate or the second substrate has an exposed surface that is exposed from the front surface metal body of the at least one of the first substrate or the second substrate at a position between the at least one spacer and the joint portion in the lateral direction and is in contact with the sealing body, and
• the joint portion is configured to be more easily deformable than the at least one spacer.