Electronic devices and methods of manufacturing electronic devices

An electronic device, comprising:

• a substrate comprising:
• a substrate first side;
• a substrate second side opposite to the substrate first side;
• and
• a conductive structure;
• a first electronic component comprising:
• a component first side coupled to the conductive structure at the substrate first side;
• a component second side opposite to the component first side;
• and
• a component lateral side connecting the component first side to the component second side;
• a lid structure comprising:
• a first lid comprising a first lid top and a first lid outer sidewall, wherein the first lid outer sidewall is coupled to the substrate first side, and wherein the first lid top is coupled to the first lid outer sidewall and comprises an opening;
• a second lid comprising a second lid top attached to the first lid top;
• and
• a lid channel in one or more of the first lid or the second lid, wherein the lid channel comprises a first channel portion comprising a first proximate end coupled to the opening and a first distal end that exits at a first lateral side of the lid structure, and wherein the second lid top covers the opening and the lid channel;
• a thermal interface material within the opening;
• and
• a first closing member coupled to the first lateral side of the lid structure and covering the first distal end of the first channel portion, wherein the first closing member comprises a deformable material that expands or contracts in response to fluid force.

A method of manufacturing an electronic device, comprising:

• providing a substrate comprising:
• a substrate first side;
• a substrate second side opposite to the substrate first side;
• and
• a conductive structure;
• providing a first electronic component comprising:
• a component first side coupled to the conductive structure at the substrate first side;
• a component second side opposite to the component first side;
• and
• a component lateral side connecting the component first side to the component second side;
• providing a first lid comprising a first lid top, a lid channel extending inward into the first lid from the first lid top, and a first lid outer sidewall, wherein the first lid outer sidewall is coupled to the substrate first side, and wherein the first lid top comprises an opening, and wherein the lid channel comprises a first channel portion comprising a first proximate end coupled to the opening and a first distal end that exits at a first lateral side of the first lid outer sidewall, and wherein the component second side is exposed through the opening over the component second side;
• providing a second lid comprising a second lid top;
• coupled to the first lid top;
• attaching the second lid top to the first lid top, wherein the second lid top covers the lid channel and the opening;
• providing a thermal interface material within the opening;
• and
• providing a first closing member coupled to the first lid outer sidewall and the second lid, wherein the first closing member covers the first distal end of the first channel portion, and wherein the first closing member comprises a deformable material that expands or contracts in response to fluid force.