H10W 72/383
Reinforcing structures
Official title: {Reinforcing structures, e.g. collars}
H10W72/383 (Reinforcing structures) appears on 71 US grants and 94 published applications in this corpus.
Search patents in H10W- Granted patents
- 71
- Published applications
- 94
- Assignees
- 45
- Inventors
- 192
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 0 | 2 |
| 2013 | 1 | 1 |
| 2014 | 1 | 5 |
| 2015 | 6 | 9 |
| 2016 | 4 | 4 |
| 2017 | 6 | 7 |
| 2018 | 3 | 1 |
| 2019 | 4 | 7 |
| 2020 | 4 | 9 |
| 2021 | 8 | 10 |
| 2022 | 6 | 6 |
| 2023 | 7 | 14 |
| 2024 | 8 | 7 |
| 2025 | 8 | 9 |
| 2026 | 5 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- EMI cage for microstrip routing via dual layer underfill concept18 Aug 2026US 12,713,928 B2Intel Corporation
- Chip on film package with multilayer composite bumps bonded to multiple leads on a substrate14 Jul 2026US 12,685,204 B2Chipbond Technology Corporation
- Flexible electronic circuits with support structures21 Apr 2026US 12,610,823 B2Pragmatic Semiconductor Limited
- Display panel, tiled display device including the same, and manufacturing method thereof24 Mar 2026US 12,588,559 B2AUO Corporation
- Semiconductor package including a barrier structure covering connection pads and contacting a protruding portion of an adhesive layer27 Jan 2026US 12,538,803 B2Samsung Electronics Co., Ltd.
- Package structure and method for forming the same18 Jun 2026US 2026/0173954 A1Stats Chippac Semiconductor (Jiangyin) Co., Ltd.
- Semiconductor element bonding substrate, semiconductor device, and power conversion device12 Feb 2026US 2026/0047465 A1Mitsubishi Electric Corporation
- Semiconductor package including a plurality of semiconductor chips11 Dec 2025US 2025/0379176 A1Samsung Electronics Co., Ltd.
- Integrated circuit package and method of forming same13 Nov 2025US 2025/0349785 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall9 Oct 2025US 2025/0316639 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Semiconductor device and method of manufacturing the same6US 8,618,667 B2Hitachi, Ltd. · 2013
- Package-on-package semiconductor device6US 9,111,896 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package-on-package semiconductor device6US 9,685,426 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Methods and apparatus for package with interposers5US 8,994,176 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Substrate warpage control using external frame stiffener5US 9,355,966 B2Avago Technologies General IP (Singapore) Pte. Ltd. · 2016