Package structure and method for forming the same

Abstract

A package structure and a method for forming the package structure are provided. The package structure includes: a substrate, where the substrate includes an optical module area, the optical module area includes an electrical connection area and an edge area adjacent thereto arranged in a direction toward an edge of the substrate; an optical device arranged on a top of the substrate in the optical module area, where the electrical connection area of the substrate is electrically connected to the optical device; a barrier structure located at the top of the substrate in the edge area, where a surface of the barrier structure is provided with a non-wetting material; and an underfill layer located between the optical device and the substrate in the electrical connection area, where the underfill layer is in contact with the substrate and the optical device.

Dependencies are inferred from the claim text.