Package-on-package semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Der-Chyang Yeh
Life of this patent
Estimating the term…
Abstract
Some embodiments relate to a semiconductor device. The semiconductor device includes a substrate and a first die coupled to a top surface of the substrate. A second die is coupled to a bottom surface of the substrate. A thermal contact pad couples the second die to the bottom surface of the substrate. The thermal contact pad electrically isolates the first die from the second die. A molding compound resides over the substrate and surrounds the first and second dies and the thermal contact pad.
Claims20
A semiconductor device, comprising:
- a top die package having a plurality of first dies on a top packaging substrate;
- a bottom die package having at least one second die on a bottom packaging substrate;
- a first set of conductive elements electrically connecting the top die package and the bottom die package;
- a thermal contact pad between a top surface of the bottom die package and a bottom surface of the top packaging substrate, wherein the thermal contact pad thermally isolates the bottom die package from the top packaging substrate;
- and
- a molding compound surrounding the thermal contact pad, the top packaging substrate, and the bottom die package.
A semiconductor device comprising:
- a top die package having at least two stacked dies on a top packaging substrate;
- a first set of conductive elements electrically coupling the at least two stacked dies to the top packaging substrate;
- a first molding compound on the top packaging substrate, wherein the first molding compound surrounds the at least two stacked dies and the first set of conductive elements;
- a bottom die package having at least one die on a bottom substrate;
- a thermal contact pad and a seal ring between a top surface of the at least one die and a bottom surface of the top packaging substrate;
- and
- a second set of conductive elements electrically coupling the top die package to the bottom die package.
A semiconductor device comprising:
- a substrate;
- a first die coupled to a top surface of the substrate;
- a second die coupled to a bottom surface of the substrate;
- a thermal contact pad coupling the second die to the bottom surface of the substrate, wherein the thermal contact pad electrically isolates the first die from the second die;
- and
- a molding compound over the substrate and surrounding the first and second dies and the thermal contact pad.
Dependencies are inferred from the claim text.